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Products · In-rack liquid parts产品 · 机柜内液冷部件

Do the parts inside the rack publish ratings that let warm water reach the chip?机柜内的部件是否公布了足以让温水到达芯片的额定值？

Over the next three years the in-rack parts decide whether warm water reaches the chip.未来三年，机柜内部件决定暖水能否到达芯片。

Evidence checked 2026-10-13, reviewed monthly证据核查 2026-10-13，每月复核

Quick disconnects are standardised: OCP UQD/UQDB v2.0.0 rated flow by size快接头已经标准化：OCP UQD/UQDB v2.0.0 各尺寸额定流量
UQD 02 2.27 L/minUQD 04 6.44 L/minUQD 06 11.36 L/minUQD 08 17.79 L/min
UQD 02 2.27 L/minUQD 04 6.44 L/minUQD 06 11.36 L/minUQD 08 17.79 L/min
OCP UQD/UQDB v2.0.0 sets per-size requirements: maximum operating pressure 6.89 bar (100 psi), minimum burst 20.68 bar, at least 5,000 coupling cycles, operating 5–65 °C. Its 'maximum flow' guidance is a 5 m/s velocity limit, which is the basis of Stäubli's flow figures, so they are not rated flows. Cv conditions: Stäubli states water at 998 kg/m³ and 1.08 cSt, flow direction socket to plug; Danfoss's flow chart states water at 60 °F, but its table does not assign that condition to each value. Values are not ranked. CPC and Parker datasheets could not be retrieved.OCP UQD/UQDB v2.0.0 按尺寸规定要求：最高工作压力 6.89 bar（100 psi），最低爆破压力 20.68 bar，至少 5,000 次插拔，工作温度 5–65 °C。其“最大流量”建议以 5 m/s 流速为限，这正是 Stäubli 流量数字的依据，所以那不是额定流量。Cv 条件：Stäubli 写明水、密度 998 kg/m³、黏度 1.08 cSt、流向从母端到公端；丹佛斯的流量图写明 60°F 的水，但其表格没有把该条件对应到每个数值。数值不做排名。CPC 和 Parker 的数据表无法获取。
15kW

Cold-plate design CoolIT says it has validated for 45 °C warm-water systemsCoolIT 称已为 45 °C 温水系统验证的冷板设计

Vendor claim厂商宣称CoolITCoolIT
0of 7

Cold-plate lines whose source gives thermal resistance and pressure drop at a stated flow, coolant and inlet temperature来源同时给出热阻和压降、并写明流量、冷却液和进液温度的冷板系列

From the owner judgement出自站长判断Judgement判断 Cold-plate table冷板表
6.89bar

Maximum operating pressure in OCP UQD/UQDB v2.0.0, which also sets at least 5,000 coupling cycles and 5–65 °C operationOCP UQD/UQDB v2.0.0 规定的最高工作压力；该规范还规定至少 5,000 次插拔、工作温度 5–65 °C

Open specification开放规范OCPOCP

The owner's judgement作者判断

Inside the rack, cold plates take heat off the chips, manifolds share the coolant across servers, and quick disconnects let a server leave the loop. What do vendors state about each, and which parts are standardised?在机柜里，冷板把热量从芯片带走，分水器把冷却液分配到各台服务器，快接头让服务器可以脱离回路。厂商对每种部件写了什么？哪些已经标准化？

Willow Lei · judgementWillow Lei · 判断

Over the next three years the in-rack parts decide whether warm water reaches the chip; CoolIT has already validated a 15 kW cold-plate design for 45 °C warm-water systems.

Quick disconnects are standardised by OCP's UQD/UQDB v2.0.0, but none of the seven cold-plate lines I checked gives thermal resistance and pressure drop at a stated flow, coolant and inlet temperature.

Until OCP's new cold-plate test specification turns into published ratings, warm-water plant decisions rest on a part whose ratings the buyer cannot compare.

未来三年，机柜内部件决定暖水能否到达芯片；CoolIT 已经按 45 °C 暖水系统验证了 15 kW 的冷板设计。

快接头已由 OCP UQD/UQDB v2.0.0 标准化，但我检查的七个冷板系列里，没有一个给出在给定流量、介质和进液温度下的热阻和压降。

在 OCP 新的冷板测试规范转化为公布的额定值之前，暖水冷站的决策依赖于一个买家无法比较额定值的部件。

Sources: 来源：[1] [2] [3]

Timeline slice: the latest six events that happened, then the stated plans时间轴切片：最近六个已发生事件，然后是公布的计划

Filled dot: happened. Hollow dot and "Planned": a stated plan with its window; it stays a plan until a source confirms it happened. The full six-year roadmap is further down.实心点：已发生。空心点加"计划"：公司公布的计划及其时间窗口；在有来源确认发生前一直是计划。完整六年路线图在下方。

Three part types三类部件

Rule: one card per part type, with what its sources state.规则：每类部件一张卡片，写明其来源说了什么。

Cold plates冷板

None of the cited cold-plate sources gives both thermal resistance and pressure drop at a stated flow, coolant and inlet temperature.所引用的冷板资料中，没有一份同时给出在给定流量、介质和进液温度下的热阻和压降。

7 rows7 行

Quick disconnects快接头

OCP UQD/UQDB v2.0.0 sets per-size requirements: maximum operating pressure 6.89 bar (100 psi), minimum burst 20.68 bar, at least 5,000 coupling cycles, operating 5–65 °C.OCP UQD/UQDB v2.0.0 按尺寸规定要求：最高工作压力 6.89 bar（100 psi），最低爆破压力 20.68 bar，至少 5,000 次插拔，工作温度 5–65 °C。

4 rows4 行

Rack manifolds机柜分水器

Manifolds are specified by rack, port count and connector rather than by heat load.分水器按机柜、接口数量和接头规格定义，而不是按热负荷。

4 rows4 行

Compare two or three自选两到三款比较

○ = not stated by the vendor. Values keep the vendor's own conditions; they are not a ranking. Choose "—" in the third box to compare two.○ = 厂商未标称。数值保留厂商自己的工况，不构成排名。第三个框选"—"即可只比较两款。

Full roadmap 2023 Q4 – 2029 Q3 (23 events), who earns the revenue, and the method完整路线图 2023 年第四季度至 2029 年第三季度（23 个事件）、谁获得收入、方法

Roadmap, 2023 Q4 – 2029 Q3路线图，2023 年第四季度至 2029 年第三季度

Dated events from official sources. Planned events show the window the source states; passing the window does not prove shipment. No future model is inferred.来自官方来源的有日期事件。计划事件显示来源给出的时间窗口；窗口过去并不代表已经出货。不推测未来型号。

Cold plates冷板

  1. May 20242024 年 5 月 CoolIT launches OMNI all-metal cold plates: over 1,500 W processor TDP and over 300 W/cm² heat fluxCoolIT 发布 OMNI 全金属冷板：处理器 TDP 超过 1,500 W，热流密度超过 300 W/cm²
  2. Sep 20242024 年 9 月 Envicool's cold plates, UQD connectors and rack manifolds pass Intel qualification英维克的冷板、UQD 快接头和机柜分水器通过英特尔认证
  3. Mar 20252025 年 3 月 CoolIT tests a 4,000 W single-phase cold-plate design: over 97% heat capture at 6 L/min; thermal resistance below 0.009 °C/W stated separatelyCoolIT 测试 4,000 W 单相冷板设计：6 L/min 时热量捕获率超过 97%；另行给出热阻低于 0.009 °C/W
  4. Sep 20252025 年 9 月 Schneider makes the Motivair portfolio, including Dynamic Cold Plates, available worldwide施耐德在全球推出 Motivair 产品组合，包括 Dynamic Cold Plates
  5. Nov 20252025 年 11 月 Envicool shows a pumped two-phase cold-plate system英维克展示泵驱两相冷板系统
  6. May 20262026 年 5 月 Cooler Master reports supplying cold plates and manifolds for NVIDIA MGX racksCooler Master 报告为 NVIDIA MGX 机柜供应冷板和分水器
  7. Jun 20262026 年 6 月 Delta shows its NVIDIA Vera Rubin NVL72 cold plate at Computex台达在 Computex 展示 NVIDIA Vera Rubin NVL72 冷板
  8. Jun 20262026 年 6 月 CoolIT validates a 15 kW single-phase cold-plate design for 45 °C warm-water systems (a design, not a shipping product)CoolIT 验证面向 45 °C 暖水系统的 15 kW 单相冷板设计（设计验证，不是量产产品）
  9. Sep 20262026 年 9 月 OCP's single-phase direct-to-chip cold plate test specification v1.0.0 takes effectOCP 单相直接芯片冷板测试规范 v1.0.0 生效
  10. Target Nov 2026目标 2026 年 11 月 Ecolab introduces a 3D TRASAR cooling platform with CoolIT cold plates at Supercomputing艺康在 Supercomputing 大会推出含 CoolIT 冷板的 3D TRASAR 冷却平台 announced Jul 20262026 年 7 月公布 planned计划

Quick disconnects and manifolds快接头与分水器

  1. Feb 20242024 年 2 月 Danfoss introduces UQD couplings for data-center liquid cooling in four sizes丹佛斯推出四种尺寸的数据中心液冷 UQD 快接头
  2. Apr 20242024 年 4 月 OCP's ORv3 blind-mate manifold specification, revision 1.0, is dated April 2024OCP ORv3 盲插分水器规范 1.0 版的文件日期为 2024 年 4 月
  3. Oct 20242024 年 10 月 Vertiv launches the CoolChip Fluid Network rack manifold维谛发布 CoolChip Fluid Network 机柜分水器
  4. May 20252025 年 5 月 Auras shows an AI rack manifold and an AI building manifold at Computex双鸿在 Computex 展示 AI 机柜分水器和 AI 建筑分水器
  5. Jul 20252025 年 7 月 CPC introduces Everis UQD06 connectors with a 3/8-inch flow pathCPC 推出 Everis UQD06 快接头，流道 3/8 英寸
  6. Aug 20252025 年 8 月 Danfoss launches UQDB08, completing its blind-mate range (sizes 02 to 08)丹佛斯推出 UQDB08，盲插系列补齐 02 至 08 四种尺寸
  7. Dec 20252025 年 12 月 Danfoss launches compact MQD/MQDB couplings: sizes 02–04, 2–6.8 L/min丹佛斯推出紧凑型 MQD/MQDB 快接头：02–04 尺寸，2–6.8 L/min
  8. Sep 20262026 年 9 月 OCP's combined UQD/UQDB design specification v2.0.0 takes effectOCP 合并版 UQD/UQDB 设计规范 v2.0.0 生效

Ownership and factories收购与工厂

  1. Nov 20252025 年 11 月 Daikin Applied announces the acquisition of negative-pressure cooling specialist Chilldyne大金应用宣布收购负压液冷专业公司 Chilldyne
  2. Dec 20252025 年 12 月 CoolIT opens its Starfield factory (112,000 ft²) for cold plates through CDUsCoolIT 启用 Starfield 工厂（11.2 万平方英尺），生产从冷板到 CDU 的产品
  3. Mar 20262026 年 3 月 Eaton completes the Boyd Thermal acquisition伊顿完成收购 Boyd 热管理业务
  4. Apr 20262026 年 4 月 Vertiv announces the acquisition of Strategic Thermal Labs for cold-plate design维谛宣布收购 Strategic Thermal Labs，加强冷板设计
  5. Jul 20262026 年 7 月 Ecolab completes the CoolIT acquisition (about USD 4.75 billion)艺康完成收购 CoolIT（约 47.5 亿美元）

Who earns the revenue谁获得这部分收入

Listed companies in the registry behind the products on this page: 本页产品背后、在上市公司名单中的公司：VertivVertiv, Schneider ElectricSchneider Electric, nVentnVent, Envicool英维克, Delta Electronics台达电子, DaikinDaikin. Outside the registry: 不在名单中：CoolIT (owned by Ecolab since 2026-072026 年 7 月起归属艺康); Boyd Thermal (owned by Eaton since 2026-032026 年 3 月起归属伊顿); Cooler Master (private非上市); Stäubli (private非上市); Danfoss (private非上市); CPC (Dover) (part of Dover; not in this registryDover 旗下；不在本名单中); Parker (listed in New York; not in this registry纽约上市；不在本名单中). See the value-chain map查看产业链地图 · CDU deep diveCDU 深度分析

Method方法

Specifications come from each vendor’s datasheet, brochure or product page and the OCP specification; each source was extracted by two different models and ruled against the saved text. Events come from vendor and OCP pages; each was checked by script on the page and by an independent model. OCP's cold-plate test specification: https://www.opencompute.org/wp-content/uploads/2026/10/OCP-Cold-Plate-Test-Specification-V1.0.0.pdf. Evidence cut-off 2026-10-13. Personal research, not investment advice.规格来自各厂商的数据表、样本或产品页以及 OCP 规范；每个来源由两个不同模型分别提取，并对照保存的原文裁定。事件来自厂商和 OCP 页面，每条都经脚本在原页面核对并由独立模型复核。OCP 冷板测试规范：https://www.opencompute.org/wp-content/uploads/2026/10/OCP-Cold-Plate-Test-Specification-V1.0.0.pdf。证据截止 2026-10-13。个人研究，不构成投资建议。

Database view: cold plates, quick disconnects and manifolds数据库视图：冷板、快接头与分水器15 rows15 行
Showing显示 15

○ = not stated by the vendor (explained once here, not repeated in words in each cell).○ = 厂商未标称（只在此说明一次，不在每格重复文字）。

Cold plates: what the vendors state冷板：厂商写了什么

None of the cited cold-plate sources gives both thermal resistance and pressure drop at a stated flow, coolant and inlet temperature. CoolIT's published test results are the clearest numbers: a 4,000 W test vehicle with over 97% heat capture at 6 L/min and, stated separately, thermal resistance below 0.009 °C/W; and a 15 kW design validated for 45 °C warm-water systems.所引用的冷板资料中，没有一份同时给出在给定流量、介质和进液温度下的热阻和压降。CoolIT 公布的测试结果数字最清楚：4,000 W 测试件在 6 L/min 时热量捕获率超过 97%，另行给出热阻低于 0.009 °C/W；以及按 45 °C 暖水系统验证的 15 kW 设计。

Company and line公司与产品What the source states来源写明的内容Coolant and materials介质与材料
Envicool · Coolinside CPU/GPU cold plates英维克 · Coolinside CPU/GPU 冷板heat flux up to 100 W/cm² with whole-plate pressure drop below 30 kPa (no flow or inlet temperature stated)热流密度最高 100 W/cm²，整板压降低于 30 kPa（未写流量或进液温度）not stated未披露
Chilldyne (Daikin Applied) · negative-pressure cold platesChilldyne（大金应用）· 负压冷板“Supports loads up to 2000W” (conditions not stated)“支持最高 2000 W 负载”（未写工况）water, negative-pressure loop水，负压回路
Delta · AI server cold plate loop台达 · AI 服务器冷板回路“Power Consumption: 3100W” (as printed; not stated as cooling capacity)“Power Consumption: 3100W”（按原文；未说明是冷却能力）flexible copper tube柔性铜管
CoolIT (Ecolab) · OMNI all-metal cold platesCoolIT（艺康）· OMNI 全金属冷板“CoolIT’s coldplates typically show upwards of 60% lower thermal resistance than standard coldplate designs” (general claim for CoolIT cold plates); the brief also plots OMNI thermal resistance against flow (0.50–1.50 L/min) without readable values or inlet temperature“CoolIT 冷板的热阻通常比标准冷板低 60% 以上”（针对 CoolIT 冷板的总体说法）；技术简报另画出 OMNI 热阻随流量（0.50–1.50 L/min）的曲线，没有可读数值和进液温度all-metal全金属
Boyd (Eaton) · custom direct-to-chip cold platesBoyd（伊顿）· 定制直接芯片冷板no performance figures; every plate 100% leak and flow tested before shipment无性能数字；每块冷板出厂前 100% 做泄漏和流量测试aluminium, copper, stainless steel; deionized water or water-glycol铝、铜、不锈钢；去离子水或水与二醇的混合液（原文未指定二醇种类）
Strategic Thermal Labs (Vertiv) · CP-BISStrategic Thermal Labs（维谛）· CP-BISno thermal rating; leak-proof operation up to 2,068 kPa (300 psi) operating pressure无热性能额定值；在最高 2,068 kPa（300 psi）工作压力下不泄漏all-metal brazed, or thermoplastic with O-ring全金属钎焊，或热塑性加 O 型圈
Cooler Master · GPU/CPU cold-plate kitCooler Master · GPU/CPU 冷板套件no performance figures; integrated leak detection无性能数字；集成漏液检测not stated未披露

Quick disconnects: vendor tables against the OCP specification快接头：厂商数据与 OCP 规范对照

OCP UQD/UQDB v2.0.0 sets per-size requirements: maximum operating pressure 6.89 bar (100 psi), minimum burst 20.68 bar, at least 5,000 coupling cycles, operating 5–65 °C. Its 'maximum flow' guidance is a 5 m/s velocity limit, which is the basis of Stäubli's flow figures, so they are not rated flows. Cv conditions: Stäubli states water at 998 kg/m³ and 1.08 cSt, flow direction socket to plug; Danfoss's flow chart states water at 60 °F, but its table does not assign that condition to each value. Values are not ranked. CPC and Parker datasheets could not be retrieved.OCP UQD/UQDB v2.0.0 按尺寸规定要求：最高工作压力 6.89 bar（100 psi），最低爆破压力 20.68 bar，至少 5,000 次插拔，工作温度 5–65 °C。其“最大流量”建议以 5 m/s 流速为限，这正是 Stäubli 流量数字的依据，所以那不是额定流量。Cv 条件：Stäubli 写明水、密度 998 kg/m³、黏度 1.08 cSt、流向从母端到公端；丹佛斯的流量图写明 60°F 的水，但其表格没有把该条件对应到每个数值。数值不做排名。CPC 和 Parker 的数据表无法获取。

Size尺寸OCP rated flow L/min (GPM)OCP 额定流量 L/min（GPM）OCP max fluid loss per cycle mLOCP 每次插拔最大漏液 mLDanfoss UQD: rated flow L/min, Cv, fluid loss cc, max working pressure丹佛斯 UQD：额定流量 L/min、Cv、漏液 cc、最高工作压力Stäubli UQD: flow at 5 m/s L/min, Cv, nominal diameterStäubli UQD：5 m/s 流量 L/min、Cv、公称通径
022.27 (0.6)0.022.1 · Cv 0.33 · 0.007 · 20 bar2.12 · Cv 0.37 · DN 3
046.44 (1.7)0.036.4 · Cv 1.37 · 0.01 · 16 bar8.48 · Cv 1.15 · DN 6
0611.36 (3.0)0.0411.4 · Cv 2.37 · 0.022 · 6.9 bar11.55 · Cv 2.52 · DN 7
0817.79 (4.7)0.0717.8 · Cv 5.32 · 0.03 · 6.9 bar23.56 · Cv 3.65 · DN 10

Sources: 来源：OCP UQD/UQDB v2.0.0OCP UQD/UQDB v2.0.0 · Danfoss Hansen UQD/UQDB丹佛斯 Hansen UQD/UQDB · Stäubli UQD/UQDBStäubli UQD/UQDB · Envicool UQD/UQDB (SUS316/316L housing, EPDM seal; no size table)英维克 UQD/UQDB（SUS316/316L 壳体，EPDM 密封；无尺寸表）

Rack manifolds机柜分水器

Manifolds are specified by rack, port count and connector rather than by heat load.分水器按机柜、接口数量和接头规格定义，而不是按热负荷。

Company and line公司与产品What the source states来源写明的内容
Vertiv · CoolChip Fluid Network (RM1xx)维谛 · CoolChip Fluid Network（RM1xx）36, 42 or 48 ports; coupling ID 3, 6 or 9 mm; max operating pressure 8 bar (116 psi); 304 stainless steel; 42U–52U racks36、42 或 48 个接口；接头内径 3、6 或 9 mm；最高工作压力 8 bar（116 psi）；304 不锈钢；42U–52U 机柜
CoolIT (Ecolab) · rack manifolds for EIA, ORV3 and MGXCoolIT（艺康）· 适配 EIA、ORV3、MGX 的机柜分水器42–52 connection points; blind-mate options; FD83 TCS connection; treated stainless steel42–52 个连接点；可选盲插；FD83 二次侧接口；处理过的不锈钢
nVent · RackChiller rack manifold RCM42001nVent · RackChiller 机柜分水器 RCM42001FD83 supply and return; ORB-6 ports; 38 × 38 mm stainless tube; racks above 45UFD83 供回水接口；ORB-6 接口；38 × 38 mm 不锈钢管；45U 以上机柜
Envicool · Coolinside MDU030S / MDU030D英维克 · Coolinside MDU030S / MDU030DSUS304 and SUS316L listed by configuration; several section sizes listed按配置列出 SUS304 和 SUS316L；列出多种截面尺寸