Historical edition.历史版本。 An earlier research edition of the AI and thermal roadmaps, kept as published. The current timeline is on Products; the chip roadmap is on the GPU page and the chiller roadmap on the chillers page.AI 与热管理路线图的早期研究版,原样保留。当前时间轴见产品页;芯片路线图见 GPU 页,冷机路线图见冷机页。

Evidence cutoff证据截止

AI chips and thermal roadmapsAI 芯片与热管理路线图

Sourced figures and open unknowns stay apart. A disagreement is not disclosed.有来源的数字和未知项分开。不一致的点不披露。

How to read a figure怎样读一个数字

Each number keeps the basis named by its source. Chip power, rack IT load, server input, and a facility design value are not converted into one another.每个数字保留来源写出的口径。芯片功率、单机柜负荷、服务器输入和设施设计值互不换算。

A solid mark has the conditions the chart requires. A hollow mark is a family range or is missing a condition. A gray row was not placed on the axis.实心表示图表要求的条件已经写明。空心表示产品族区间或缺少条件。灰色行没有放上坐标。

Where two sources disagree, the disputed point is not disclosed.两份来源不一致时,争议点不披露。

Chips芯片NVIDIA, AMD, and Huawei Ascend. Chip power and single-rack IT load.英伟达、AMD 与华为昇腾。芯片功率和单机柜负荷。 Thermal热管理Air-cooled and water-cooled chillers, coolant distribution, fan walls, rear doors, and control evidence.风冷与水冷冷机、冷却液分配、风墙、后门,以及控制证据。

Limits边界

These are vendor disclosures from one retrieval, not a buying recommendation and not an independent test. Unknowns are left unknown. Nothing on these pages is a project rack configuration.这些是一次检索中的厂商披露,不是采购建议,也不是独立测试。未知项保持未知。这些页面不采用项目自己的机柜配置。