Historical edition.历史版本。An earlier research edition of the AI and thermal roadmaps, kept as published. The current timeline is on Products; the chip roadmap is on the GPU page and the chiller roadmap on the chillers page.AI 与热管理路线图的早期研究版，原样保留。当前时间轴见产品页；芯片路线图见 GPU 页，冷机路线图见冷机页。
Chip power and rack IT load芯片功率与单机柜负荷
Three lanes: NVIDIA, AMD, and Huawei Ascend. Server input power is in the table, not in a rack badge.三条泳道：英伟达、AMD、华为昇腾。服务器输入功率在表里，不进机柜徽标。
Google TPU and AWS Trainium stay off this chart because they are offered only as cloud services.Google TPU 和 AWS Trainium 只在云上提供，因此不进入这张图。